The effects of a spray slurry nozzle on copper CMP for reduction in slurry consumption

Abstract

The environmental impact of semiconductor manufacturing has been a big social problem, like greenhouse gas emission. Chemical mechanical planarization (CMP), a wet process which consumes chemical slurries, seriously impacts environmental sustainability and cost-effectiveness. This paper demonstrates the superiority of a full-cone spray slurry nozzle to the conventional tube-type slurry nozzle in Cu CMP. It was observed that the spray nozzle made a weak slurry wave at the retaining ring unlike a conventional nozzle, because the slurry was supplied uniformly in broader areas. Experiments were implemented with different slurry flow rates and spray nozzle heights. Spray nozzle performance is controlled by the spray angle and spray height. The process temperature was obtained with an infrared (IR) sensor and an IR thermal imaging camera to investigate the cooling effect of the spray. The results show that the spray nozzle provides a higher Material removal rate (MRR), lower non-uniformity (NU), and lower temperature than the conventional nozzle. Computational fluid dynamics techniques show that the turbulence kinetic energy and slurry velocity of the spray nozzle are much higher than those of the conventional nozzle. Finally, it can be summarized that the spray nozzle plays a significant role in slurry efficiency by theory of Minimum quantity lubrication (MQL).