Abstract
In this study, pulsating electric current was applied during the electroless Ni plating process. The applied current is controlled to avoid the formation of an immersion (displacement) deposit. The effects of the current density (0.5 and 1.0 A/dm 2), duty cycle (0 to 100%, in a step of 10%), and bath pH value (4.4 and 4.8) were investigated systematically. The as-plated coatings were examined by atomic force microscopy, transmission electron microscopy, X-ray diffraction, synchrotron X-ray absorption spectroscopy, etc. Amorphous or amorphous-like microstructure was obtained for all as-plated coatings and the phosphorus content was higher than 8.9 wt.%. Experimental results showed that pulsating electric current can initiate Ni nanocrystallization (∼ 5 nm), improve crystal growth, and accelerate electroless Ni deposition. An obvious increase in deposition rate was also observed with pulsating electric current.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
