The Effect of Two‐Dimensional Nucleation on the Rate of Electrocrystallization

Abstract

The effect of random two‐dimensional nucleation on current‐potential curves, valid for epitaxial electrodeposition on single‐crystal faces, has been examined employing a specific model for nucleation and surface step motion. Computations have been performed for the electrodeposition of silver and copper: for the first metal the results are in reasonable agreement with some experimental data concerning two‐dimensional nucleation on close‐packed surfaces. In the case of copper the agreement with experimental results seems to be less satisfactory. The influence of assumptions, such as the type of surface step distribution, on the rate of electrocrystallization has been examined and discussed. Computer simulations of potentiostatic transients have also been carried out, and some effects of suppressing nucleation in the vicinity of steps have been investigated.