The effect of thickness of niobium isolation layer on properties of copper-based Nb3Sn films

Abstract

Copper-based Nb3Sn film is a promising material for applications in the field of superconducting radio frequency (SRF). However, the interdiffusion of copper (Cu) from the substrates into the Nb3Sn films affects the superconductivity of the samples, and the preparation of Nb3 Sn–Nb–Cu composite films is a good solution. In this paper, the effects of the niobium (Nb) layer thickness on Cu interdiffusion and the critical temperature of Nb3Sn film were investigated. Nb3 Sn–Nb films were deposited on Cu substrates by magnetron sputtering. The obtained samples have been characterized via focused ion beam (FIB), time of flight secondary ion mass spectrometry (TOF-SIMS), and magnetic property measurement system (MPMS). It was found that the thicker the Nb isolation layer, the stronger the hindrance effect on the Cu interdiffusion and the higher the critical temperature. A suitable Nb isolation layer thickness was 2.6μm, which effectively hindered the Cu interdiffusion, corresponding to a critical temperature of 16.6 K for the samples.