The effect of thermal mismatch on Z-pinned laminated composite structures

Abstract

Z-pinning is a method of improving the through-thickness properties of composite laminates by inserting a solid pin through the laminate prior to curing. The thermal expansion mismatch between the Z-pin and base laminate produces large residual stresses during the cure cycle. Finite element modelling has shown that these stresses are greater than the failure stress of standard resin systems indicating the resin around the Z-pin should fail. This was confirmed through microscopy, which showed cracking around the perimeter of the Z-pin. Changing the material properties and dimension of the model to represent different Z-pinning situations could not significantly reduce the residual stresses, indicating cracking should occur in all Z-pinned laminates. These results show that probably all published Z-pinning properties have been obtained from laminates that would have exhibited cracking, indicating that the improved through-thickness properties are due more to mechanical interlocking than bonding. Questions are raised about the suitability of using Z-pinned laminates in specific applications, and the effects of increased moisture ingress and long term durability.