The effect of the Ni/Cu ratio on H-induced ductility loss and its mechanism in Cu–Ni binary alloy system

Abstract

The effect of the Ni/Cu ratio on hydrogen embrittlement (HE) behavior is studied in the context of the Cu–Ni binary alloy system. When classifying HE sensitivity as a function of the Ni fraction, two regimes are obtained: Regime 1 (wherein Ni fraction is less than 80 wt%) with moderate HE and Regime 2 (where Ni fraction exceeds 80 wt%) with more severe HE, although hydrogen- (H-)induced intergranular (IG) cracking is noted to be the common primary cause of H-induced degradation. Necessities of H-transportation towards grain boundaries (GBs) via H–dislocation interaction and/or dynamic H-diffusion are discussed via the slow strain rate tensile tests at −196 °C. Specifically, in Regime 1, H-transportation is necessary for the triggering of IG cracking. Conversely, in Regime 2, such H-transportation plays a minor role and the initially concentrated hydrogen along GBs can sorely cause IG cracking.