Abstract
Back Grinding of Wafer with Outer Rim (BGWOR) is a novel method for carrier-less thinning of silicon wafers. Silicon wafers are widely used in integrated circuits (ICs). The topography of the wafer will not only directly affect the efficiency of subsequent processing of semiconductor devices, but correspondingly affect the performance and life of these devices. However, there are few studies on the shape of the ground wafer in BGWOR. In this paper, the mathematical model of the wafer topography in BGWOR was developed. With this model, the radial thickness and total thickness variation (TTV) of a wafer under different parameters, including inclination angles and radii of grinding wheel for dressing chuck, were simulated by MATLAB. Inclination angles and radii of grinding wheels for the dressing chuck had a great influence on the radial thickness and TTV of a wafer in the BGWOR. Lastly, the pilot experiments were conducted to validate the theoretical model of grinding topography and TTV of the wafer in BGWOR. To enhance the flatness of the ground wafer, it is essential to control the shape of the dressing chuck. The research results are helpful to the optimization of the dressing process of the chuck in the BGWOR.
Highlights
The 3D package is the key packaging technique for integrated circuit chips in the post-Moore’s law era
The topography of the wafer will directly affect the number of layers on the chip, and even cause difficulties for subsequent processing
Back Grinding of Wafer with Outer Rim (BGWOR) shown in Figure 1 is a new method for carrier-less thinning of silicon wafers
Summary
The 3D package is the key packaging technique for integrated circuit chips in the post-Moore’s law era. They studied the effect of the angles of the grinding wheel on the shape of chuck and wafer. The influence of the inclination angles and radius of the dressing grinding wheel on the shape and TTV of a wafer in BGWOR was analyzed.
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