Abstract
A Cu-Sb base alloy containing 4.5 at. pet Sb was chosen to investigate the effect of third elements on cellular precipitation. The third element was added at the following levels: 0.3, 0.6, 1.0 and 2.0 at. pctX. In no case could a change in the morphology be observed. The third elements, however, have a large effect on the incubation times. The growth ratev and lamellar spacingl were measured as functions of temperature and evaluated according to the models of Aaronson and Kirkaldy. The temperature dependence of thebDI values yields the activation energy for interface diffusion. The activation energy values thus found deviate between up to +28 pet and −14 pet from that of the undoped base-alloy.
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