Abstract
Monocrystalline Si materials has been widely used in the fields of micro-electro-mechanical systems and electronic chips. At the micro and nanoscale, there are differences in the mechanical properties at the workpiece side compared to its interior. Meanwhile, temperature also has a significant impact on the mechanical properties of materials. In this paper, to analyze the effect of the temperature on the nanoindentation side effect of monocrystalline Si, a series of molecular dynamics (MD) simulations of nanoindentation are performed under six different temperatures. The simulation results show that the plastic deformation behavior, indentation force, internal stress, and the Internal defects are closely related to the temperature in nanoindentation. This work attributes a better understanding of the temperature effect on the nanoindentation side effect of the monocrystalline Si materials.
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