Abstract
Linear tape recording devices typically employ contact recording to minimize head/media magnetic spacing and thus maximize recording density. Successful contact recording is a delicate balance between spacing and contact pressure. If an air bearing develops, spacing will exceed the 100 nm upper limit for current high recording density devices. Conversely, high contact pressure can lead to head wear or tape damage. Most recording heads produced today for linear tape devices consist of one or more cylindrical wafer sections that are bonded together to form a rigid structure. Each individual tape bearing surface is cylindrical with straight edges. The tape is held over the head contact surface by tape guides so that the tape is wrapped sharply around the edges where cylindrical surface and flat surface meet. Overwrap angle is defined as the angle between the tape after it leaves the head and a tangent to the cylindrical head surface at the edge where cylindrical surface and flat surface meet. This paper will use one-dimensional finite element modeling to explore how overwrap angle and bump radius affect head/tape spacing and contact pressure. The effects of tape stiffness, tape tension, and tape velocity will be investigated. Feasible combinations of overwrap angle and bump radius will be presented which minimize head/tape separation, yet keep contact pressure within bounds.
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