Abstract
The paper investigates the effect of commonly used subtractive manufacturing technologies on the scattering parameter of an Ultra-WideBand (UWB) antenna that was designed, realized, and measured. As a result, the conventional copper layer etching method using two chemical solutions based on ferric chloride and hydrochloric acid, as well as the Computer Numerical Control (CNC) machining, are critically analyzed. As proven by the obtained results, the etchant, its temperature, and the etching time has a direct effect on the quality of the realized UWB antenna’s edges. Along with the scattering parameter of the antenna, the cross sections’ analysis of the quality of the edges is presented. The Printed Circuit Board (PCB) with the copper layer was used in three thicknesses (17.5, 35, and 70 $\mu$m) for the experiments described in the paper. The polyimide film with a thickness of 50 $\mu$m was used as the substrate material. Due to the thin polymeric film and the narrow width of the feeding element (330 $\mu$m), CNC machining is at the limit of its possibilities. Additionally, the paper analyzes the effect of the etching solution’s temperature on the edge quality in the high frequency area.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
