Abstract
Thin (001) single-crystal copper substrates were contaminated by exposure to the atmosphere. Electrodeposition of nickel took place upon the contaminated surface. Duplex films as well as stripped deposits were examined by transmission electron microscopy and electron diffraction. In contrast to deposition onto clean substrates, small three-dimensional (3-D) nuclei formed at the start of deposition. Deposits became continuous at an average thickness of ≈50Å. Apart from the small initial nuclei, larger block-like growths were observed. Contrast phenomena as well as the results of misfit measurements suggested that the lattices were initially strained to give a coherent nickel-copper interface.
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