The effect of substrate on the microstructure and preferred orientation of nanocrystalline copper prepared by electrodeposition

Abstract

AbstractIn the present work, nanocrystalline copper thin films have been prepared by electrodeposition using a high purity copper as anode. Two types of substrate have been used, one bcc low carbon steel and one fcc austenitic stainless steel. The deposition current density has been controlled at different values ranging from 20 to 80mA/cm2. SEM and X‐ray diffraction (XRD) technique have been used to characterise the deposited thin films. The orientation index, as evaluated using Harris method, shows a strong <110> texture with orientation index about 4 for copper deposited but on bcc low carbon steel substrate only. The grain sizes of the nanocrystalline copper have been evaluated following the Scherrer method. (© 2008 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)