Abstract
In the present work, several W-25wt% Cu alloys have been prepared through combined processes of high-energy ball-milling, liquid-phase sintering and infiltration, using the precursors of industrial copper powders with an average particle size of 50μm and tungsten powders with alternative average particle size of 8μm, 800nm, 600nm or 400nm. Microstructure characteristics, relative density, hardness and electrical conductivity of the WCu alloys were investigated to elucidate the effect of initial particle size of tungsten powders. EBSD was further utilized to reveal the orientation and grain size distribution in the WCu alloys prepared by 8μm and 400nm-sized tungsten powders. The results showed that the WCu alloy made by 400nm-sized tungsten powders exhibited excellent homogeneity for both sintered tungsten powders and grains, together with the highest relative density of 98.9%, the highest hardness of 230 HB, and good electrical conductivity of 48.7% IACS. Moreover, it also showed highly improved arc erosion and mechanical wear resistances.
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