Abstract
Solder masks are used universally on high density printed circuit boards to reduce the occurrence of solder bridges between adjacent tracks and pads. The use of solder mask can, however, have a deleterious effect on the solderability, i.e., the solder pull‐through and top‐land wetting, of plated‐through‐hole boards. This work considers, quantitatively, the specific effect on PTH board solderability of solder mask, considering in turn the three classes of photoimageable dry film, photoimageable ink and screen printed ink. Two modes of solderability degradation have been identified: a geometrical effect that depends on the thickness of the mask and its encroachment around the solderable pads, and a contamination effect arising from the development and washing of the photoimageable masks from surfaces to be soldered subsequently.
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