Abstract
The demand of LiTaO 3 (LT) wafer mainly used as substrate of SAW (Surface Acoustic Wave) filter device has been quite increasing in recent years. From the viewpoint of LT wafer's productivity in the polishing process, high removal rate and good recycle stability are required for slurry to eliminate generated damages in the previous process. In this study, the effect of pH and particle size in the slurry on the removal rate and the polishing stability of LT wafer were investigated. We found out that acid slurry containing large particle can achieve high removal rate with good recycle stability. The balance of pH and particle size would be taken advantage of polishing other hard brittle or chemically stable materials such as sapphire, silicon carbide and gallium compounds.
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