Abstract

AbstractWe report on the differences in the epitaxial growth mechanisms between Ge1−xCx (O<x<0.1) and Ge1−x−ySixCy (x=0.2, 0<y<0.05) alloys grown on Si(100) using low temperature( 200°C) molecular beam epitaxy. Thin films (50˜65nm) were characterized in situ by RHEED and ex situ by transmission electron microscopy and x-ray diffraction. With increasing C concentration, the microstructure of both Ge and GeSi alloys changes from 2D layer growth to 3D islanding. The d400 spacing of the relaxed alloys decreases marginally, with a maximum of 1at.% C being substitutionally incorporated. Ge-C films with higher C content have a high density of planar defects, typically twins and stacking faults. The addition of 20% Si does not appear to increase the amount of substitutional C in the films. Rather, the additions of 20% Si to Ge-C alloys somehow seems to enhance the tendency for the formation of planar defects.

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