Abstract
Molecular dynamics is employed to study the nanoscale high speed grinding process of single crystal copper with rough surface. Material removal behavior of the cooper workpiece through diamond grinding is studied. The effects of texture density, texture direction, texture shape and the tool with rough or smooth surface are thoroughly investigated in terms of atomic trajectories, temperature distribution, radial distribution function, grinding temperature, grinding force, and friction coefficient. It can be found that a larger texture density results in lowering a surface smoothness of workpiece in the local area, and reduces the partial protrusion, specifically when the texture density is greater than 90%. The material removal and the smoothness of ground surface strongly depend upon the effects of texture orientation and shape. The quality of the ground surface at texture orientation parallel with the x-axis is the best. The texture shape that intensely influences the chip and the groove depends on the size of the contact surface, suggesting that the material removal mechanism is roughly the same under different texture shapes. The smooth prismatic tips generate a more chips than the rough prismatic tip, while the volume of the material pileups is less than that of the rough one, which means that the prismatic diamond tip with smooth surface has an absolute advantage than the rough tip to machine nanostructures and greatly improves the material removal rate. These results show that it is possible to control and tune the grinding parameters according to texture density, direction and shape during machining single crystal copper with rough surface, and provides a potential way to improve a surface integrity and a smoothness of machined surface.
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