Abstract
Adhesion and residual stress play a critical role in the performance and reliability of MEMS (micro-electromechanical systems). The effects of residual stress on the pull-in instability of the micromechanical structure were examined using thin plate theory and energy criterion. It is shown that the critical gap between the film and the substrate is a function of the ratio of residual stress to bending rigidity and the adhesion energy. Such instability is mitigated by the presence of in-plane tensile residual stress in the film. But, it is aggravated by the presence of compressive residual stress. In addition, the effect of compressive residual stress is much more significant than tensile residual stress.
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