Abstract
AbstractThe effect of elevated temperature excursions (thermal spiking) on the moisture absorption characteristics and dynamic mechanical properties of Cycom 8 HS carbon fibre epoxy laminates was investigated. Cured laminate samples were preconditioned (65d̀C, 95%R.H.) and these samples were exposed to various thermal spiking (150d̀C/2min) programmes. Dynamic mechanical thermal analysis (DMTA) techniques measured the changes in glass transition temperature (Tg) storage modulus (log E') and damping (Tan δ max) of the laminates as a result of exposure to these environments. The thermal spiking programme was shown to cause an increase in both the amount and rate of moisture absorption of the laminates. These increments were accompanied by a significant decrease in Tg, log E', and Tan δ max. Scanning Electron Microscopy (SEM) analysis also showed the progressive growth of both interlaminar and translaminar micro‐cracks as a result of thermal spiking.
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