Abstract
A single-pulse discharge system for semiconductors was designed and produced. Single-pulse discharge experiments with single-crystal silicon were conducted, and the morphology of the electric erosion pit under different discharge energy levels was observed. Three removal forms, namely, heat removal, stress removal, and secondary crushing in electrical discharge machining (EDM) of single-crystal silicon, were discovered, and the mechanisms of semiconductor discharge processing were described. Finally, the role of different removal forms in single-crystal silicon EDM was explained and verified.
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