Abstract
The resin activators' type and quantity in a solder paste have a significant effect on reflow behaviour. These interact with the effects of the oxygen content of the reflow atmosphere and the condition of the surfaces to be joined. While these parameters might be expected to influence solder paste reflow behaviour, more subtle effects related to the physical characteristics of the resin/solvent solution have also been observed.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have