Abstract
Flip chip test boards with and without plasma enhanced chemical vapor deposition silicon nitride moisture barrier coatings were exposed to high humidity and temperature cycling conditions. The effect of the stress developed in these environments was investigated and evaluated. The influence of the barrier layers on the extent of underfill delamination and degradation in flip chip assemblies was inspected by C‐mode Scanning Acoustic Microscopy. The moisture barrier layers studied show their potential to enhance the reliability of flip chip assemblies in humid environments.
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