Abstract
Epitaxial growth of Al2O3 on Si has been investigated by using ultrahigh-vacuum chemical vapor deposition (UHV-CVD). Film thickness uniformity in a wafer was progressed by UHV-CVD method with a hot wall heating system, but the film surface morphology of grown films was worse than that grown by low-pressure chemical vapor deposition (LP-CVD) with a cold wall heating system. Reaction between Si surface and N2O was carried out by LP-CVD and UHV-CVD, and it is supposed that N2O gas etches the Si surface rather than O2 gas at the initial growth stage in UHV-CVD. High crystalline quality of Al2O3 films was obtained at 1000°C by changing the oxidation source gas from N2O to O2. Al2O3 film crystalline quality and electrical property were improved by using O2 gas.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
