Abstract
Abstract In this study, the effect of multi-walled carbon nanotubes (MWCNT) reinforcement on joint shear strength and microstructural development of tin-3.0silver-0.5copper (SAC305)/copper solder joint subjected to multiple reflow cycles was investigated. The MWCNT-reinforced SAC305 solder systems (SAC305-x MWCNT; x = 0.01, 0.05, 0.1, and 0.5 wt.%) were developed by a mechanical dispersion method. The microstructural, mechanical, and melting properties of SAC305 composite solders were evaluated as a function of different wt.% of MWCNT addition. The melting behavior of composite solders was analyzed using differential scanning calorimetry. The morphology and intermetallic compound growth at the solder joint interface were studied using scanning electron microscopy. The copper/solder/copper micro-lap-shear solder joint specimens reflowed for multiple reflow cycles were systematically characterized to evaluate the joint shear strength. The results showed that the reinforcement in the range of 0.01–0.05 wt.% of MWCNT resulted in the improvement of joint shear strength and better wettability compared to plain SAC305 solder alloy. Amongst all compositions analyzed, SAC305-0.05MWCNT nanocomposite suppressed the intermetallic compound layer growth effectively leading to improvement in the joint shear strength under multiple reflow cycles.
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