Abstract
The effect of electrical migration upon electrochemical deposition is investigated using a thin-layer electrodeposition method. The experiment is carried out by both methods of electrodeless and electrode reductions of silver ions from a solution. The silver metal is grown around the copper deposition plate within a Hele-Shaw cell under an electric field which is induced by the electrodes positioned outside the cell. It is shown that a locally electric migration has an important effect on the deposition profile. For comparing with the experiment, an extended DLA simulation is carried out to take into account the local electric field. It is found that the deposition profile obtained by the simulation is consistent with the experimental result.
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