Abstract
We consider the thermoelastic problem of an interface crack between two dissimilar semi-infinite isotropic materials under a uniform remote heat flux in plane deformation. The crack face is assumed to be partially thermopermeable (defined by a partial insulation coefficient of the crack), while the interface is assumed to be perfectly bonded except that a constant thermal resistance is introduced into the interfacial region near the tips of the crack. By using the integral transform method, we obtain the analytic solution for the thermoelastic field in the entire bi-material system. Numerical examples are presented to study the influence of interfacial thermal resistance on the thermal stress intensity factors and the crack opening/sliding displacements. It is shown that the magnitudes of the mode I and mode II TSIFs, as well as the crack opening displacements, increase with the increasing interfacial thermal resistance, while the crack sliding displacement is insensitive to the change of interfacial thermal resistance.
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