Abstract
Effect of grain size and Cl-concentration on corrosion behavior of Cu was investigated by using a series of electrochemical analysis in borate buffer solution (pH=8.40).The results indicated that in all cases, the Mott-Schottky plots of the passive films on the surface of Cu were linear with negative slop, and showed behavior of the p-type semiconductor.With the decrease of the grain size and the increase of anode passivation potential, the acceptor density (NA) of the passivation film on the surface of Cu was reducing. As the concentration of Cl-in the medium solution was heightening, the acceptor density (NA) of the passivation film on the surface of Cu was increasing.
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