Abstract
Abstract The wetting properties of Sn–8.5Zn–0.5Ag–0.1Al– x Ga lead-free solders were investigated. The wetting time and wetting angle decreased while the wetting force increased with the increase in Ga content. The intermetallic compounds were Al 4.2 Cu 3.2 Zn 0.7 , Cu 5 Zn 8 , Cu 5 Zn 8 and AgZn 3 in the solder. The activation energy and the surface tension of the solder were estimated.
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