The effect of electrical charge density on the transition behavior between bonding and clogging stages of an electroplated porous surface

Abstract

A copper plate with a porous layer on its outer surface can significantly enhance heat transfer performance compared with a smooth copper plate. In this work, different from the traditional powder sintering technique, a porous layer consisting of copper powders was prepared by an electroplating method. The bonding mechanism of this electroplated porous surface was analyzed by using scanning electron microscope (SEM) imaging and the X-ray diffraction (XRD) technique. The influences of the electrical charge density adopted in the preparation process on the appearance and oxide phase of the electroplated porous surface were investigated by a 3D optical profiler and energy dispersive spectroscopy (EDS) technique. Moreover, the bonding strength and anti-disturbance ability of the electroplated porous surface were summarized via a thrust test and an ultrasonic vibration test, respectively. Using water droplet spreading and down-absorption tests, the variation of wettability of the prepared porous surface was discussed. With an optimum electrical charge density, it is feasible to securely construct copper powders onto a substrate and form an inter-connective porous layer without compromising its mechanical and porous properties.