Abstract
Co-evaporated Cu-Ti films on thermally-oxidized Si substrates were annealed in vacuum at temperatures between 300 and 700° C. Reactions within the films and between film and substrate were monitored by Rutherford backscattering spectrometry, X-ray diffraction, transmission electron microscopy and sheet resistance. We found that, despite the competition from intermetallic compound formation, the Cu-Ti films react with SiO 2 beginning at 400°C, with Ti migrating to the SiO 2 interface to form both a silicide, Ti 5 Si 3 , and an oxide and to the free surface to form additional oxide. The reaction leaves relatively pristine Cu. Above 600°C, however, Cu begins to react with the underlying silicide. By comparison, pure Ti reacts with SiO 2 only above ˜700°C.
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