Abstract

Sections of human tooth enamel were exposed to concentrated hydrogen peroxide solution for periods of time ranging from 1 to 60 min. Some sections were posttreated with 37% phosphoric acid for 60 s and others were pretreated (etched) with 37% phosphoric acid for 60 s. Each of the sections used in the study was compared with a control specimen from the same tooth area which was exposed only to saline before and after treatment with 37% phosphoric acid for 60 s. A comparison of control and experimental sections indicated that exposure to concentrated hydrogen peroxide solution produced a precipitate on the enamel surface. The amount of precipitate appeared to be related to the length of the hydrogen peroxide exposure. The combination of hydrogen peroxide and acid etching resulted in an enamel surface that displayed more precipitate and appeared to be more porous than enamel surfaces used as controls. The significance of these findings relative to the adhesion of dental materials to bleached enamel surface is discussed. Sections of human tooth enamel were exposed to concentrated hydrogen peroxide solution for periods of time ranging from 1 to 60 min. Some sections were posttreated with 37% phosphoric acid for 60 s and others were pretreated (etched) with 37% phosphoric acid for 60 s. Each of the sections used in the study was compared with a control specimen from the same tooth area which was exposed only to saline before and after treatment with 37% phosphoric acid for 60 s. A comparison of control and experimental sections indicated that exposure to concentrated hydrogen peroxide solution produced a precipitate on the enamel surface. The amount of precipitate appeared to be related to the length of the hydrogen peroxide exposure. The combination of hydrogen peroxide and acid etching resulted in an enamel surface that displayed more precipitate and appeared to be more porous than enamel surfaces used as controls. The significance of these findings relative to the adhesion of dental materials to bleached enamel surface is discussed.

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