Abstract
Anodic oxide films formed on Fe26Cr in pH 2.0 H 2SO 4 solution in the presence and absence of Cl − ions have been investigated using electrochemical techniques and Auger electron spectroscopy (AES) combined with ion sputtering. It is possible to incorporate Cl − ions into passive oxide films formed over the entire passive potential range only when Cl − is present in the solution from the very beginning of film formation. Cl − ion incorporation does not cause any change in film thickness or Fe/Cr ratio, or any film thinning or film breakdown. A relatively short anodization in Cl −-free solution is sufficient to prevent any subsequent Cl − ion incorporation. The susceptibility of the passive film to Cl − attack appears to depend on the presence of small amounts of impurity in the alloy. A 99.97% pure alloy does not pit, whereas a 99.93% pure alloy, with larger concentrations of C, S, Mn, Co and Ni, does suffer intergranular attack in Cl − solution.
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