The Effect of Backside Particles on Substrate Topography

Abstract

The presence of a particle on the backside of a wafer is commonly acknowledged to produce a deflection of the wafer when it is held on a flat surface by means of a pressure difference. We simulated this wafer topography, taking into account both elastic and plastic deformations. The simulations are backed up by experimental evidence. The results show that height variations of 100 nm can extend over several mm. At the same time, indentation and plastic deformation reduce the surface height variations to values that are orders of magnitude below those predicted in the ITRS roadmap.