Abstract
The behavior of a piezoelectric sensor is strongly affected by the bonding condition along the interface between the sensor and the host structure. This article presents an analytical study of the effect of the mechanical and geometrical properties of the adhesive layer on the coupled dynamic electromechanical behavior of a thin piezoceramic sensor bonded to an elastic medium. A sensor model with an imperfect adhesive bonding layer is proposed to simulate the two dimensional electromechanical behavior of the integrated system. The analytical solution of the problem is provided by solving the resulting integral equations in terms of the interfacial stress. Numerical simulation is conducted to study the effect of the bonding layer upon the dynamic response of the sensor under different loading frequencies. The interfacial debonding and its effect on the interlaminar strain and stress transfer mechanisms are discussed in detail.
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