Abstract
AbstractThe dielectric, dynamic mechanical, and melting (denaturation) behavior of reconstituted collagen has been investigated. Dynamic mechanical properties are reported for the range of temperature from −100 to 220°C. Dielectric properties are reported for the range of temperature from −120 to 90°C. Possible origins of dynamic mechanical and dielectric relaxations are discussed. Effect of moisture content on mechanical and dielectric behavior is also presented. The melting process of collagen immersed in diluents as well as that of dry collagen were studied by the techniques of hot‐stage polarizing microscopy, differential thermal analysis, thermal mechanical analysis, and small‐angle light scattering. It was concluded that the melting point of dry collagen is about 217°C.
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