Abstract
The performance of smart structures depends on the dynamic electromechanical behavior of piezoelectric actuators and the bonding condition along the interface, which connects the actuators and the host structures. This paper provides a theoretical study of the influence of material parameters of the bonding layer on the coupled electromechanical characteristics of piezoelectric actuators, which are subjected to high frequency electric loads. A one-dimensional actuator model with a bonding layer, which undergoes a shear deformation, is proposed. Analytical solutions based on the integral equation method are provided. Detailed numerical simulation is conducted to evaluate the effect of the bonding layer under different loading frequencies. The results indicate that the properties of the bonding layer, the loading frequency, the material combination and the geometry of the actuator have a significant effect on the load transfer between the actuator and the host medium.
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