The Dissociation of Gallium–Hydrogen Pairs in Crystalline Silicon during Illuminated Annealing

Abstract

Hydrogen‐rich crystalline Si samples are produced by coating Ga‐doped Czochralski‐grown silicon wafers with SiNx:H and subsequent rapid thermal anneal. This procedure introduces H2 dimers into the bulk, which enables the formation of gallium–hydrogen pairs (GaH). The change in pair concentration can be determined by change in resistivity, as pair formation consumes holes. During illumination at elevated temperature (180 °C), some of the previously formed GaH pairs dissociate into H and/or H2 within hours. A subsequent anneal step forms the pairs again. If illumination is prolonged to days at 180 °C, a second dissociation phase occurs after which GaH pairs do not form again in the dark. Therefore, probably two processes are ongoing: a reversible (fast) one and an irreversible (slow) dissociation of GaH pairs in crystalline silicon. The fraction of dissociated pairs and rate of dissociation depend on temperature and excess charge carrier concentration. This suggests an electron‐driven, thermally activated back reaction into either H dimers or atomic hydrogen. An Arrhenius analysis reveals a possibly injection‐dependent activation energy of the reversible dissociation process in the range of 0.64–0.71 eV. Lifetime measurements reveal a drastic increase in effective defect density during the second decrease in pair concentration.