The displacement of the thermally grown oxide in thermal barrier systems upon temperature cycling

Abstract

Models that characterize the displacement instability of the thermally grown oxide (TGO) found in some thermal barrier systems are reviewed, consolidated and extended. It is demonstrated that the simulations are only consistent with the observations whenever the bond coat and TGO both undergo plastic deformation. The TGO yields at the peak temperature, during growth, while the bond coat yields on thermal cycling. The trends oppose. Namely, the TGO displacement is diminished by increasing the high temperature strength of the bond coat, but is increased upon increasing the TGO strength. The model rationalizes certain experimental trends, particularly the decrease in durability as the hot time per cycle decreases. Interactions between the instability and cracks in the thermal barrier layer are discussed.