The Disassembly Process and Apparatus of Waste Printed Circuit Board Assembly for Reusing the Components

Abstract

Printed Circuit Board Assembly (PCBA), is an important basic part of Electric and Electronic Equipment, which has lots of high-value components and toxic substances. Normally, when Electric and Electronic Equipment (EEE) is scraped, some components on waste PCBA still keep good performances. Therefore, it is feasible and economical to environment-friendly reuse the high-value components on waste PCBA. In order to guarantee the quality of the disassembled components, the components reuse-oriented disassembly process is proposed, in which the mechanical and physical characteristics of solder and the joint type of PCBA are considered comprehensively. In the process, through the analysis and measurement of the temperature distribution of PCBA, the optimized heating mode and heating temperature curve can be drawn up for the different joint type of PCBA. For getting the disassembly mode of PCBA, the disassembly force and separating displacement of components on PCBA are defined and the disassembly energy models for different kinds of components are set up. On the basis of the heating mode, heating temperature curve and disassembly energy, two kinds of disassembly apparatus and a performance testing procedure for certain kinds of old components are developed. In the end the components reuse-oriented disassembly process parameters are optimized to get a high separation ratio and reuse ration of components with orthogonal test.