Abstract
Since the advent of pulsed dc reactive sputtering, the capacity to produce high-quality dielectric films at useful rates has been well proven in industrial and research environments. A number of elegant solutions to the control of the mass balances of the reactive plasma have been developed and proven. Plasma emission monitors, partial pressure control, and others have extended the useable envelope of pulsed dc technology. One area of concern for many working with dielectric films is anode degradation of the plasma tool as it is coated with the dielectric film. This paper will examine the source of this problem and the plasma system variables that contribute to the issue. General single magnetron solutions will be described and explained with examples used for clarity. Shielding methods will be discussed and compared. Finally, a solution will be generated for a worst case example system, results examined, and costs compared with dual magnetron solutions.
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