The Dielectric Properties and Thermal Conductivities of Epoxy Composites Reinforced by Titanium Dioxide

Yuan Jia,Zhen Liu,Weijie Dong,Beibei Li,Juxiang Yang

doi:10.1007/s10904-021-02159-y

Abstract

To improve the dielectric properties and thermal conductivities of epoxy resins (EP), titanium dioxide superfine powders with microspheres structure (S-TiO2) were prepared via a hydrothermal process based on the sodium dodecyl benzene sulfonate and hydroxyl silicate. The different content of S-TiO2 was then employed as modifiers to add into EP resin to prepare the S-TiO2/EP composites. The structure and morphology of the prepared S-TiO2 was observed by X-ray diffraction (XRD) and scanning electron microscopy (SEM), and influences of different addition of S-TiO2 on the thermal conductivity of S-TiO2/EP composites are researched, while their dielectric constant and dielectric loss are also studied. The results suggested that the reasonable content of S-TiO2 can endow the S-TiO2/EP composites with higher dielectric constant without excessive increase their dielectric loss even under the high frequency. Furthermore, the thermal conductivity of S-TiO2/EP are also be improved, which can be attributed to the good thermal conductivity of S-TiO2 itself and the thermal conductivity path formed by S-TiO2 inside the EP matrix.

Highlights

With the rapid development of electronic science and technology, various of new energy products emerge one after another, and the electronic devices tend to be miniaturized, integrated and flexible [1,2]
The results suggested that the reasonable content of S-TiO2 can endow the S-TiO2/epoxy resins (EP) composites with higher dielectric constant without excessive increase their dielectric loss even under the high frequency
A novel S-TiO2 dioxide superfine powders with microspheres structure (S-TiO2) were prepared via hydrothermal process, and the S-TiO2 was employed as modifiers to prepare S-TiO2/EP composites by blending with EP matrix

Summary

Introduction

With the rapid development of electronic science and technology, various of new energy products emerge one after another, and the electronic devices tend to be miniaturized, integrated and flexible [1,2]. In order to reduce the damage of material properties caused by a large amount of heat generated during the electrical operation, the excellent thermal conductivity of materials is increasingly required [3,4]. The thermal conductivity of pure EP is within the range of 0.17-0.23 W/mK, which can basically meet the requirements of common electronic components and materials [8,9]. The second is to fill the fillers with excellent thermal conductivity such as boron nitride, aluminum nitride and alumina in to EP matrix [15,16,17], which is more simple and more flexible, this method has been applied more widely [18]. In order to minimize other additional damage caused by the fillers added into to EP, newer thermal conductivity fillers should be selected and prepared

Objectives

Methods

Results

Conclusion