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Abstract
‘Fine Pitch’ and ‘High speed printing’ are relative terms but many solder paste users see capability in meeting these two requirements as their major goals for process improvements. Not surprisingly, solder paste rheology governs both, and this paper describes how the complex relationship between resins and solvent can lead to solder pastes with optimised performance. Work on the physical behaviour of resin solutions and how this relates to solder paste rheology is reported. These results are related to user experience on volume production processes.
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