The development of correct methods for Sn–Pb solder analysis by wavelength dispersion X-ray fluorescence spectrometry

Abstract

Soldering is a process of joining metals with an extremely broad range of applications. Among the most popular of the soft alloys are tin–lead solders. The easiest method of soft solder sample preparation for XRF analysis appears to be machining (turning, milling, polishing). Nevertheless, we observed that in the case of the near-eutectic Sn–Pb solder, machining results in smearing of the lead on the sample surface. Our research had also shown the existence of significant structural differences in the crystal structure of samples produced by different producers that prevent proper analysis by XRF spectrometry. To solve the problem of smearing and obtain the smallest and most reproducible microstructures, enabling better measurement averaging, we proposed two simple and fast sample preparation procedures.