Abstract
As new generation of solid-state lighting source with green environmental protection, White LED has become the focus of attentions. Along with the development of high power LED, heat dissipation problems of LED become more and more important. This paper makes research on single-chip high power LED by ANSYS finite element software, and analyzes the thermal effects of parameters on the radiator. This paper believes that the influence of radiator materials’ thermal conductivity is not obvious, and the finned height and cooling area of radiator play an very important role in reducing chip junction temperature.
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