THE DESIGN OF MASTER PRODUCTION SCHEDULING SYSTEM FOR BALL GRID ARRAY PACKAGING PROCESS

Abstract

ABSTRACT The wafer bumping process in Ball Grid Array (BGA) packaging has three characteristics: long machine setup time, dynamical arrival of orders, and re-entrance of operations. These three properties make a factory with BGA packaging difficult to maximize its capacity utilization while having all orders meeting their due dates. Therefore, we design a master production scheduling (MPS) system for wafer bumping process which aims for having high due date achievement as well as doing customer order promising. The MPS system first estimates the cycle time roughly. Then a mixed integer programming (MIP) model is applied to optimize the setup schedule. With estimated cycle times and setup schedules, the master production scheduling system can plan master production schedules wich are capable to meet the due date requirement and can handle the task of customer order promising. The case studies show that this MPS system generates feasible master production schedules with high due date achievement.