Abstract
The difference of CTE leads to stress concentration at the interface in the package. The underfill material is wildly used for reducing the mismatch of CTE in the flip chip package. Moreover, the ingress of moisture in underfill material will affect the failure behaviour of solder ball. In this paper, the analysis of solder ball delamination involving thermal and moisture concentration is performed. The results demonstrate that the moisture concentration can not be ignored in reflow, especially in lower temperature range. The swelling coefficient of moisture is additional factor assist delamination except mismatch of CTE during solder reflow.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
