Abstract
Investigation was made of the glass transition temperature (Tg) and the curing reaction mechanism of a new maleimide resin containing epoxy groups. It was found that the Tg of the cured product depended on the reaction temperature and a good heat-resistant product could be obtained under appropriate conditions. This Tg was above 200°C. The reaction mechanism is discussed using measured activation energy and infrared spectra. The primary reaction changed at about 180°C. Both the addition of diamine to the double bond and epoxy group occurred below 180°C. The polymerization of double bonds of bismaleimide took place simultaneously with the above-mentioned two reactions above 180°C.
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