Abstract
The organosilicone gel material for large-power LED packaging was prepared through Si-H addition reaction of hydrogen-silicone with vinyl-silicone catalyzed by Pt coordination compound in this paper. The curing behavior was investigated by DSC method, and the curing dynamic parameters were obtained, i.e., the curing activation energy and reaction level of the system were 79.23kJ/mol and 0.8271 respectively, the initial curing temperature, maximum curing temperature and post-curing temperature were 75°C, 90°Cand 120°C, respectively, which supplied the basic data for the preparation and application of organosilicone materials for large-power LED packaging.
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