Abstract
The critical current density (J <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">c</inf> ) of internal tin wires is increased when low-temperature diffusion heat treatments are performed prior to a high temperature reaction. To determine the variation of J <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">c</inf> with pre-reaction heat treatments a copper-stabilized IGC internal tin wire with an outside diameter of 0.267mm was studied. The wire has 2 to 2.5 μm diameter filaments, and within the Ta barrier, the area ratio of the copper matrix and Sn core to Nb is about 2.2. Due to the character of the Cu-Sn phase diagram, heat treatments at a series of temperatures below the Nb <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</inf> Sn reaction temperature affect the local Sn concentration in the matrix about the Nb filaments. The variation in J <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">c</inf> resulting from these heat treatments is a consequence of the microstructural state of the conductor and the morphology of the Nb <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</inf> Sn layer produced. The results of this work show that the internal tin and bronze-processed wires have different J <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">c</inf> (H) characteristics. The two processes have comparable critical currents at high fields, suggesting the same H <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">c2</inf> , while at low fields the internal tin wire is superior, suggesting a better grain morphology.
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